Projects per year
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Projects
- 4 Finished
Combining Large-area Electronics with High-performance Computation for Scalable Ambient Intelligence
NSF - National Science Foundation
7/1/12 → 6/30/16
Project: Research project
Research Output
Large-area resistive strain sensing sheet for structural health monitoring
Aygun, L. E., Kumar, V., Weaver, C., Gerber, M., Wagner, S., Verma, N., Glisic, B. & Sturm, J. C., Mar 1 2020, In : Sensors (Switzerland). 20, 5, 1386.Research output: Contribution to journal › Article
Open Access
3
Scopus
citations
Reducing Energy of Approximate Feature Extraction in Heterogeneous Architectures for Sensor Inference via Energy-Aware Genetic Programming
Tang, Y., Jia, H. & Verma, N., May 2020, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 67, 5, p. 1576-1587 12 p., 8952908.Research output: Contribution to journal › Article
17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing
Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications
Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
5
Scopus
citations
A 3-D IC for Mitigating Energy of Memory Accessing and Data Movement in Accelerator-Based Streaming Architectures
Chen, L. Y., Tao, S. & Verma, N., Jun 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1778-1788 11 p., 8630831.Research output: Contribution to journal › Article
Press / Media
US Patent Issued to The Trustees of Princeton University on July 12 for "System and method for interfacing large-area electronics with integrated circuit devices" (New Jersey Inventors)
7/13/16
1 item of Media coverage
Press/Media: Press / Media
Air Force Office of Scientific Research: AFOSR grants go to 42 scientists/engineers through its Young Investigator Research Program
Naveen Verma, Amir Ali Ahmadi & David Wentzlaff
2/16/14
1 item of Media coverage
Press/Media: Press / Media
AFOSR grants go to 42 scientists/engineers through its Young Investigator Research Program
Naveen Verma, Amir Ali Ahmadi & David Wentzlaff
1/27/14
1 item of Media coverage
Press/Media: Press / Media