Projects per year
Fingerprint Dive into the research topics where Naveen Verma is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 3 Similar Profiles
Electronic equipment
Engineering & Materials Science
Sensors
Engineering & Materials Science
Networks (circuits)
Engineering & Materials Science
Static random access storage
Engineering & Materials Science
Thin film transistors
Engineering & Materials Science
Learning systems
Engineering & Materials Science
Thin films
Engineering & Materials Science
Electroencephalography
Engineering & Materials Science
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects 2012 2019
- 4 Finished
Combining Large-area Electronics with High-performance Computation for Scalable Ambient Intelligence
NSF - National Science Foundation
7/1/12 → 6/30/16
Project: Research project
Research Output 2005 2019
17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing
Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C. & Verma, N., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 280-282 3 p. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Compressed sensing
Thin film transistors
Hybrid systems
Skin
Electronic equipment
22.8 Adaptively Clock-Boosted Auto-Ranging Responsive Neurostimulator for Emerging Neuromodulation Applications
Pazhouhandeh, M. R., Orleary, G., Weisspapir, I., Groppe, D., Nguyen, X. T., Abdelhalim, K., Jafari, H. M., Valiante, T. A., Carlen, P., Verma, N. & Genov, R., Mar 6 2019, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., p. 374-376 3 p. 8662458. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; vol. 2019-February).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Brain
Technology
Implanted Electrodes
Sleep Stages
Neurosciences
A 3-D IC for Mitigating Energy of Memory Accessing and Data Movement in Accelerator-Based Streaming Architectures
Chen, L. Y., Tao, S. & Verma, N., Jun 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1778-1788 11 p., 8630831.Research output: Contribution to journal › Article
Particle accelerators
Integrated circuits
Data storage equipment
Network routing
Pipelines
3
Citations
(Scopus)
A 64-Tile 2.4-Mb In-Memory-Computing CNN Accelerator Employing Charge-Domain Compute
Valavi, H., Ramadge, P. J., Nestler, E. & Verma, N., Jun 1 2019, In : IEEE Journal of Solid-State Circuits. 54, 6, p. 1789-1799 11 p., 8660469.Research output: Contribution to journal › Article
Tile
Neurons
Particle accelerators
Convolution
Data storage equipment
A Large-Area RFID Reader Array Using Large-Area Electronics
Mehlman, J. Y., Kumar, P., Verma, N. & Sturm, J., Mar 25 2019Research output: Innovation
Press/Media
US Patent Issued to The Trustees of Princeton University on July 12 for "System and method for interfacing large-area electronics with integrated circuit devices" (New Jersey Inventors)
7/13/16
1 item of Media coverage
Press/Media: Press / Media
Air Force Office of Scientific Research: AFOSR grants go to 42 scientists/engineers through its Young Investigator Research Program
Naveen Verma, Amir Ali Ahmadi & David Wentzlaff
2/16/14
1 item of Media coverage
Press/Media: Press / Media
AFOSR grants go to 42 scientists/engineers through its Young Investigator Research Program
Naveen Verma, Amir Ali Ahmadi & David Wentzlaff
1/27/14
1 item of Media coverage
Press/Media: Press / Media