17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing

Levent E. Aygun, Prakhar Kumar, Zhiwu Zheng, Ting Sheng Chen, Sigurd Wagner, James Christopher Sturm, Naveen Verma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Tactile sensing has wide-ranging applications, from intelligent surfaces to advanced robotics. Large-Area Electronics (LAE), based on low-temp. fabrication (< 200 {circ} {C}) of thin films, presents distinct capabilities, due to compatibility with a broad range of materials (enabling diverse transducers), as well as large and flexible substrates and materials-deposition methods (enabling expansive and formfitting sensing arrays). However, low performance/energy-efficiency of LAE thin-film transistors (TFTs) necessitates hybrid systems, integrating Si-CMOS ICs for system functions (sensor readout/control, processing, etc.). Initial work shows that a primary challenge in hybrid systems is the large number of interfaces required between LAE and CMOS, particularly as the number of sensors scales [1], [2]. This paper presents a force-sensing system that exploits signal sparsity exhibited in many large-area tactile-sensing applications (e.g., detecting point damage/stress in structures [3]), to reduce interfacing complexity to the level of sparsity, rather than a level related to the number of sensors (e.g., [1]). This is achieved via compressed sensing (CS), enabling sensor-acquisition by simple switches, readily implemented using TFTs. While CS has previously been leveraged in a hybrid-system architecture targeting signal sampling-rate requirements [2], this system applies it for high spatial resolution in tactile sensing.

Original languageEnglish (US)
Title of host publication2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages280-282
Number of pages3
ISBN (Electronic)9781538685310
DOIs
StatePublished - Mar 6 2019
Event2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 - San Francisco, United States
Duration: Feb 17 2019Feb 21 2019

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume2019-February

Conference

Conference2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
CountryUnited States
CitySan Francisco
Period2/17/192/21/19

Fingerprint

Compressed sensing
Thin film transistors
Hybrid systems
Skin
Electronic equipment
Sensors
Signal sampling
Energy efficiency
Transducers
Robotics
Switches
Fabrication
Thin films
Substrates
Processing

Cite this

Aygun, L. E., Kumar, P., Zheng, Z., Chen, T. S., Wagner, S., Sturm, J. C., & Verma, N. (2019). 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 (pp. 280-282). [8662442] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2019.8662442
Aygun, Levent E. ; Kumar, Prakhar ; Zheng, Zhiwu ; Chen, Ting Sheng ; Wagner, Sigurd ; Sturm, James Christopher ; Verma, Naveen. / 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 280-282 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).
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abstract = "Tactile sensing has wide-ranging applications, from intelligent surfaces to advanced robotics. Large-Area Electronics (LAE), based on low-temp. fabrication (< 200 {circ} {C}) of thin films, presents distinct capabilities, due to compatibility with a broad range of materials (enabling diverse transducers), as well as large and flexible substrates and materials-deposition methods (enabling expansive and formfitting sensing arrays). However, low performance/energy-efficiency of LAE thin-film transistors (TFTs) necessitates hybrid systems, integrating Si-CMOS ICs for system functions (sensor readout/control, processing, etc.). Initial work shows that a primary challenge in hybrid systems is the large number of interfaces required between LAE and CMOS, particularly as the number of sensors scales [1], [2]. This paper presents a force-sensing system that exploits signal sparsity exhibited in many large-area tactile-sensing applications (e.g., detecting point damage/stress in structures [3]), to reduce interfacing complexity to the level of sparsity, rather than a level related to the number of sensors (e.g., [1]). This is achieved via compressed sensing (CS), enabling sensor-acquisition by simple switches, readily implemented using TFTs. While CS has previously been leveraged in a hybrid-system architecture targeting signal sampling-rate requirements [2], this system applies it for high spatial resolution in tactile sensing.",
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Aygun, LE, Kumar, P, Zheng, Z, Chen, TS, Wagner, S, Sturm, JC & Verma, N 2019, 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. in 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019., 8662442, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 2019-February, Institute of Electrical and Electronics Engineers Inc., pp. 280-282, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, San Francisco, United States, 2/17/19. https://doi.org/10.1109/ISSCC.2019.8662442

17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. / Aygun, Levent E.; Kumar, Prakhar; Zheng, Zhiwu; Chen, Ting Sheng; Wagner, Sigurd; Sturm, James Christopher; Verma, Naveen.

2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 280-282 8662442 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Aygun LE, Kumar P, Zheng Z, Chen TS, Wagner S, Sturm JC et al. 17.3 Hybrid System for Efficient LAE-CMOS Interfacing in Large-Scale Tactile-Sensing Skins via TFT-Based Compressed Sensing. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 280-282. 8662442. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). https://doi.org/10.1109/ISSCC.2019.8662442