Microscopic image of engineered patterns created on Bismuth thin film Invention Summary: Rutgers Researchers have developed a new method of patterning metallic thin films. This technique provides an alternative to current thin film pattering techniques and introduces a new way of building out-of-plane structures from metallic thin films. Two of the most prevalent modes of patterning thin films are shadow masked deposition and photolithography. The former technique requires the creation of multiple yet expensive masks. The latter technique also uses masks and the process is complicated and introduces the need for a number of environmental engineering controls to deal with potentially harmful chemicals. Other techniques, e.g. ink jet printing, have their own drawbacks that must be overcome during implementation into current manufacturing process. The new technique can create rapid, reproducible and versatile patterning of thin metallic films on a flexible substrate via scanned, focused laser energy. It can be used to accumulate material from a pre-deposited film to build different patterns without having to deposit or remove material. Market Applications: Electrochemical devices Microfluidic devices Flexible sensors Implantable sensors Ingestible probes Advantages: User-determined metal feature thickness Flexible substrates allow highly adaptable geometries for consumer and industrial electronics Without deposit or remove materials Low cost Intellectual Property & Development Status: Patent pending. Application serial number 14/202,972. Available for licensing and/or research collaboration.
|Original language||English (US)|
|State||Published - Mar 2018|