A parametric study of crack propagation during sonic IR inspection

J. C. Chen, J. Kephart, William Riddell

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We have developed an experiment to study the propagation of synthetic cracks under various controlled conditions during sonic IR inspection. The experiment provides for good repeatability in testing. The parameters of interest include the initial crack length, load history (stress intensity and load ratio) during crack generation, geometry of the crack, material, and also the various conditions involving the ultrasonic source. In general, we find that under typical sonic IR inspection conditions, the initial crack will propagate when subjected to sonic IR testing. The crack growth after each inspection event varies and exhibits a distribution in length of propagation. The results show that the average crack propagation decreases with increasing initial crack length and increasing stress intensity.

Original languageEnglish (US)
Title of host publicationReview of Progress in Quantitative Nondestructive Evaluation
Subtitle of host publicationVolume 25B
Pages1577-1584
Number of pages8
Volume820 II
DOIs
StatePublished - Mar 6 2006
EventReview of Progress in Quantitative Nondestructive - Brunswick, ME, United States
Duration: Jul 31 2005Aug 5 2005

Other

OtherReview of Progress in Quantitative Nondestructive
CountryUnited States
CityBrunswick, ME
Period7/31/058/5/05

Fingerprint

crack propagation
inspection
cracks
propagation
ultrasonics
histories
geometry

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

Chen, J. C., Kephart, J., & Riddell, W. (2006). A parametric study of crack propagation during sonic IR inspection. In Review of Progress in Quantitative Nondestructive Evaluation: Volume 25B (Vol. 820 II, pp. 1577-1584) https://doi.org/10.1063/1.2184710
Chen, J. C. ; Kephart, J. ; Riddell, William. / A parametric study of crack propagation during sonic IR inspection. Review of Progress in Quantitative Nondestructive Evaluation: Volume 25B. Vol. 820 II 2006. pp. 1577-1584
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Chen, JC, Kephart, J & Riddell, W 2006, A parametric study of crack propagation during sonic IR inspection. in Review of Progress in Quantitative Nondestructive Evaluation: Volume 25B. vol. 820 II, pp. 1577-1584, Review of Progress in Quantitative Nondestructive, Brunswick, ME, United States, 7/31/05. https://doi.org/10.1063/1.2184710

A parametric study of crack propagation during sonic IR inspection. / Chen, J. C.; Kephart, J.; Riddell, William.

Review of Progress in Quantitative Nondestructive Evaluation: Volume 25B. Vol. 820 II 2006. p. 1577-1584.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chen JC, Kephart J, Riddell W. A parametric study of crack propagation during sonic IR inspection. In Review of Progress in Quantitative Nondestructive Evaluation: Volume 25B. Vol. 820 II. 2006. p. 1577-1584 https://doi.org/10.1063/1.2184710