A wafer transfer technology for MEMS adaptive optics

Eui Hveok Yang, Dean V. Wiberg

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Adaptive optics systems require the combination of several advanced technologies such as precision optics, wavefront sensors, deformable mirrors and lasers with high-speed control systems. The deformable mirror with a continuous membrane is a key component of these systems. This paper describes a new technique for transferring an entire wafer-level silicon membrane from one substrate to another. This technology is developed for the fabrication of a compact deformable mirror with a continuous face sheet. A 1 μm thick silicon membrane, 100 mm in diameter, has been successfully transferred without using adhesives or polymers (i.e. wax, epoxy, or photoresist). Smaller or larger diameter membranes can also be transferred using this technique. The fabricated actuator membrane with an electrode gap of 1.5 μm shows a vertical deflection of 0.37 urn at 55 V. The proposed technique has the following benefits over those previously reported: 1) No post-assembly release process (e.g. using HF) is required, and no wax, photoresist, or epoxy is used for the transfer purpose 2) The bonded interface is completely isolated from any acid, etchant, or solvent, which ensures a clean and flat membrane surface. 3) It offers the capability of transferring wafer-level membranes over deformable actuators.

Original languageEnglish
Title of host publicationMicro-Electro-Mechanical Systems (MEMS) - 2001
EditorsA.L. Lee, J. Simon, K. Breuer, S. Chen, R.S. Keynton, A. Malshe, J.-I. Mou, M. Dunn
Pages51-55
Number of pages5
StatePublished - 2001
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: Nov 11 2001Nov 16 2001

Publication series

NameAmerican Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
Volume3

Conference

Conference2001 ASME International Mechanical Engineering Congress and Exposition
Country/TerritoryUnited States
CityNew York, NY
Period11/11/0111/16/01

ASJC Scopus subject areas

  • General Engineering

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