Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace

A. B. Mann; J. Tapson; D. Van Heerden; A. C. Lewis; D. Josell; T. P. Weihs

doi:https://doi.org/10.1063/1.1455132

Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace

A. B. Mann, J. Tapson, D. Van Heerden, A. C. Lewis, D. Josell, T. P. Weihs

Research output: Contribution to journal › Article › peer-review

Original language	American English
Pages (from-to)	1821
Number of pages	1
Journal	Review of Scientific Instruments
Volume	73
Issue number	4
DOIs	https://doi.org/10.1063/1.1455132
State	Published - Apr 2002
Externally published	Yes

ASJC Scopus subject areas

Instrumentation

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https://doi.org/10.1063/1.1455132

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title = "Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace",

author = "Mann, {A. B.} and J. Tapson and {Van Heerden}, D. and Lewis, {A. C.} and D. Josell and Weihs, {T. P.}",

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AU - Mann, A. B.

AU - Tapson, J.

AU - Van Heerden, D.

AU - Lewis, A. C.

AU - Josell, D.

AU - Weihs, T. P.

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SP - 1821

JO - Review of Scientific Instruments

JF - Review of Scientific Instruments

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Apparatus to measure wafer curvature for multilayer systems in a vacuum furnace

ASJC Scopus subject areas

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