Convective cooling of multiple electronic components in an enclosure

E. Papanicolaou, Y. Jaluria

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations


A numerical study of the forced and mixed convective cooling of heat dissipating electronic components, located in a rectangular enclosure, and cooled by an external through-flow of air is carried out. A conjugate problem is solved, describing the flow and thermal fields in air, as well as the thermal field within the walls of the enclosure and the electronic components themselves. The interaction between the components is of interest here, depending on their relative placement in the enclosure and different configurations are considered. Laminar, steady flow is predicted for up to Gr/Re2 = 10, but a single-frequency oscillatory behavior is observed for most of the configurations studied, at Gr/Re2 = 50. Heat transfer results are presented for both the laminar and the oscillatory domains. The mixed convection regime, where the buoyancy effects are comparable to the forced flow, occurs at values of Gr/Re2 between 0.01 and 10. The results are of value in the search for a suitable placement of electronic components in an enclosed region for an effective heat removal.

Original languageEnglish (US)
Title of host publicationHeat Transfer in Electronic Equipment - 1991
PublisherPubl by ASME
Number of pages9
ISBN (Print)0791807401
StatePublished - 1991
Event28th National Heat Transfer Conference - Minneapolis, MN, USA
Duration: Jul 28 1991Jul 31 1991

Publication series

NameAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD


Other28th National Heat Transfer Conference
CityMinneapolis, MN, USA

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes


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