TY - GEN
T1 - Convective cooling of multiple electronic components in an enclosure
AU - Papanicolaou, E.
AU - Jaluria, Y.
PY - 1991
Y1 - 1991
N2 - A numerical study of the forced and mixed convective cooling of heat dissipating electronic components, located in a rectangular enclosure, and cooled by an external through-flow of air is carried out. A conjugate problem is solved, describing the flow and thermal fields in air, as well as the thermal field within the walls of the enclosure and the electronic components themselves. The interaction between the components is of interest here, depending on their relative placement in the enclosure and different configurations are considered. Laminar, steady flow is predicted for up to Gr/Re2 = 10, but a single-frequency oscillatory behavior is observed for most of the configurations studied, at Gr/Re2 = 50. Heat transfer results are presented for both the laminar and the oscillatory domains. The mixed convection regime, where the buoyancy effects are comparable to the forced flow, occurs at values of Gr/Re2 between 0.01 and 10. The results are of value in the search for a suitable placement of electronic components in an enclosed region for an effective heat removal.
AB - A numerical study of the forced and mixed convective cooling of heat dissipating electronic components, located in a rectangular enclosure, and cooled by an external through-flow of air is carried out. A conjugate problem is solved, describing the flow and thermal fields in air, as well as the thermal field within the walls of the enclosure and the electronic components themselves. The interaction between the components is of interest here, depending on their relative placement in the enclosure and different configurations are considered. Laminar, steady flow is predicted for up to Gr/Re2 = 10, but a single-frequency oscillatory behavior is observed for most of the configurations studied, at Gr/Re2 = 50. Heat transfer results are presented for both the laminar and the oscillatory domains. The mixed convection regime, where the buoyancy effects are comparable to the forced flow, occurs at values of Gr/Re2 between 0.01 and 10. The results are of value in the search for a suitable placement of electronic components in an enclosed region for an effective heat removal.
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M3 - Conference contribution
SN - 0791807401
T3 - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
SP - 29
EP - 37
BT - Heat Transfer in Electronic Equipment - 1991
PB - Publ by ASME
T2 - 28th National Heat Transfer Conference
Y2 - 28 July 1991 through 31 July 1991
ER -