Direct measurement of workpiece temperature field in surface grinding

Jihong Hwang, Sridhar Kompella, Srinivasan Chandrasekar, Thomas N. Farris

Research output: Contribution to journalArticlepeer-review


The temperature field in the workpiece during surface grinding has been measured using a charge-coupled device (CCD) based infra-red imaging system. Infra-red (IR) radiation measurements, at high spatial and temporal resolution, have been made along a side of the grinding specimen to estimate workpiece surface and sub-surface temperatures. By grinding along a taper, with a continuously increasing depth of cut, the variation in grinding temperature with material removal rate has been obtained. These measurements have correlated well with those made in conventional constant material removal rate grinding tests. The location and values of highest temperature, including temperature gradients, have been identified. Implications of the measurements for validating thermal models of grinding, and predicting the onset of thermal damage in the workpiece are discussed.

Original languageEnglish (US)
Pages (from-to)15-18
Number of pages4
Issue numberAPRIL.MAY
StatePublished - Apr 2002
Externally publishedYes

ASJC Scopus subject areas

  • Mechanical Engineering


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