TY - GEN
T1 - Effect of filler geometry on the conduction of isotropically conductive adhesives
AU - Su, Bin
AU - Qu, Jianmin
PY - 2006
Y1 - 2006
N2 - The effect of the geometry of conductive fillers on the conduction of conductive adhesives is studied. 3-D microstructure models of conductive adhesives are built to describe the positions and connections of the conductive fillers. Both rectangular flakes and spherical particles are studied. The total resistance of conductive adhesive is calculated by solving the resistor network formed by all particle connections. The method of full factorial design at two levels is used, and the geometric parameters are set at high and low level to study their effects on the resistivity of the conductive adhesive. Pareto chart of standardized effects of factors are examined for different configurations. Factors with significant effects are found. Main effect plots are used to study how significant factors affect the resistivity. Monte Carlo simulations are used for each configuration. Radius mean has the most significant effect for spherical particles, while the alignment angle is most significant for flakes.
AB - The effect of the geometry of conductive fillers on the conduction of conductive adhesives is studied. 3-D microstructure models of conductive adhesives are built to describe the positions and connections of the conductive fillers. Both rectangular flakes and spherical particles are studied. The total resistance of conductive adhesive is calculated by solving the resistor network formed by all particle connections. The method of full factorial design at two levels is used, and the geometric parameters are set at high and low level to study their effects on the resistivity of the conductive adhesive. Pareto chart of standardized effects of factors are examined for different configurations. Factors with significant effects are found. Main effect plots are used to study how significant factors affect the resistivity. Monte Carlo simulations are used for each configuration. Radius mean has the most significant effect for spherical particles, while the alignment angle is most significant for flakes.
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M3 - Conference contribution
SN - 0791842002
T3 - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
SP - 1889
EP - 1901
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Y2 - 17 July 2005 through 22 July 2005
ER -