Effect of filler geometry on the conduction of isotropically conductive adhesives

Bin Su, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The effect of the geometry of conductive fillers on the conduction of conductive adhesives is studied. 3-D microstructure models of conductive adhesives are built to describe the positions and connections of the conductive fillers. Both rectangular flakes and spherical particles are studied. The total resistance of conductive adhesive is calculated by solving the resistor network formed by all particle connections. The method of full factorial design at two levels is used, and the geometric parameters are set at high and low level to study their effects on the resistivity of the conductive adhesive. Pareto chart of standardized effects of factors are examined for different configurations. Factors with significant effects are found. Main effect plots are used to study how significant factors affect the resistivity. Monte Carlo simulations are used for each configuration. Radius mean has the most significant effect for spherical particles, while the alignment angle is most significant for flakes.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1889-1901
Number of pages13
StatePublished - 2006
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

ASJC Scopus subject areas

  • General Engineering

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