TY - GEN
T1 - Effective elastic modulus of underfill material for flip-chip applications
AU - Qu, Jianmin
AU - Wong, C. P.
N1 - Publisher Copyright: © 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - Most underfill materials are two phase composites, e.g., epoxy matrix filled with ceramic particles. The primary purpose of loading ceramic particles is to reduce the coefficient of thermal expansion (CTE) and to increase the elastic modulus. These two thermal mechanical properties are critical parameters to the thermomechanical reliability of a flip-chip package. Developing underfill materials with desired values of the CTE and elastic modulus is a key enabling technology for the next generation low-cost, high-reliability flip-chip packages. In this paper, a micromechanics model is developed to estimate the elastic modulus of underfill materials based on the properties of the matrix and the fillers. To validate the prediction from the micromechanics model, samples of underfill materials with various filler compositions are made. The moduli of these samples are measured using a Thermal Mechanical Analysis system (TMA). Satisfactory results are obtained between the theoretically predicted and experimentally measured values.
AB - Most underfill materials are two phase composites, e.g., epoxy matrix filled with ceramic particles. The primary purpose of loading ceramic particles is to reduce the coefficient of thermal expansion (CTE) and to increase the elastic modulus. These two thermal mechanical properties are critical parameters to the thermomechanical reliability of a flip-chip package. Developing underfill materials with desired values of the CTE and elastic modulus is a key enabling technology for the next generation low-cost, high-reliability flip-chip packages. In this paper, a micromechanics model is developed to estimate the elastic modulus of underfill materials based on the properties of the matrix and the fillers. To validate the prediction from the micromechanics model, samples of underfill materials with various filler compositions are made. The moduli of these samples are measured using a Thermal Mechanical Analysis system (TMA). Satisfactory results are obtained between the theoretically predicted and experimentally measured values.
UR - https://www.scopus.com/pages/publications/0031636703
UR - https://www.scopus.com/pages/publications/0031636703#tab=citedBy
U2 - 10.1109/ECTC.1998.678806
DO - 10.1109/ECTC.1998.678806
M3 - Conference contribution
SN - 0780345266
T3 - Proceedings - Electronic Components and Technology Conference
SP - 848
EP - 850
BT - 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 48th Electronic Components and Technology Conference, ECTC 1998
Y2 - 25 May 1998 through 28 May 1998
ER -