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INVESTIGATION OF THERMAL, DIELECTRIC AND MECHANICAL CHARACTERISTICS OF POLYMER NANOCOMPOSITE FILMS

  • Jared Ericksen
  • , Michael Smith
  • , John Terifay
  • , Nicholas Insinga
  • , John Hayes
  • , Joseph Marshina
  • , Benjamin Olitsky
  • , Madeline Seybold
  • , Matthew Olivo
  • , Logan Allison
  • , Amit Singh
  • , Wei Xue

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nanocomposites have the unique ability to improve various properties of a host material while allowing it to maintain its other properties and form factor. Polymers can function as excellent host materials because of their strong intrinsic properties and their ability to accept a wide variety of nano-scale fillers. These polymer nanocomposites have the capacity to improve the field of high-temperature superconducting (HTS) power transmission. HTS power transmission allows for significant weight reductions as well as improved power/volume capacity when compared with standard copper wire systems. HTS still requires further technical development to become widely applicable. With the current lack of thermally stable dielectric insulation materials, polymer nanocomposites can provide the proper blend of thermal, electrical, and mechanical properties necessary to create the ideal superconducting cable. This paper discusses the characterization of poly (pyromellitic dianhydride-co-4,4’oxydianiline), amic acid (PAA) and silicon dioxide (SiO2) nanocomposites. It has been determined that increasing nanoparticle concentration can lead to improved electrical and mechanical properties for various test methods, including liquid nitrogen (at -60℃ and -196℃) and gas helium (at room temperature) environments. These testing environments relate directly to potential HTS applications and provide valuable insight into the nanocomposites’ applicability in real-world applications.

Original languageAmerican English
Title of host publicationMechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791888681
DOIs
StatePublished - 2024
EventASME 2024 International Mechanical Engineering Congress and Exposition, IMECE 2024 - Portland, United States
Duration: Nov 17 2024Nov 21 2024

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume10

Conference

ConferenceASME 2024 International Mechanical Engineering Congress and Exposition, IMECE 2024
Country/TerritoryUnited States
CityPortland
Period11/17/2411/21/24

ASJC Scopus subject areas

  • Mechanical Engineering

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