Parylene X: A candidate cross-linkable chemical vapor depositable polymer for wafer-to-wafer bonding

Jay J. Senkevich, Brad P. Carrow, Benjamin W. Woods, Rex E. Murray, John F. McDonald

Research output: Contribution to conferencePaper

Abstract

A chemical vapor depositable (CVD) polymeric adhesive is just not in the lexicon of science. We have recently developed a new CVD precursor 4-ethynyl[2.2]paracyclophane, which yields poly(ethynyl-p-xylylene) (parylene X) at room temperature on the parylene equipment platform. As-deposited it exists as a linear chain polymer with ethynyl pendant groups. The deposition uses no solvent, no catalysts, no initiator and is very suitable for semiconductor manufacturing. In particular it could be used as an adhesive for wafer-to-wafer bonding for the fabrication of 3-D integrated devices. The dielectric adhesive approach has the advantage of possessing low thermal diffusivity thereby blocking heat flow into sensitive memory bonded on top of high performance logic. Parylene X, presented here has adequate thermal stability (∼420 °C) and predominately cross-links between 200 °C and 300 °C, with full completion at 380 °C. These temperatures are suitable for the processing of gigascale integrated devices.

LanguageEnglish (US)
Pages468-473
Number of pages6
StatePublished - Dec 1 2005
Externally publishedYes
Event22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 - Fremont, CA, United States
Duration: Oct 4 2005Oct 6 2005

Other

Other22nd International VLSI Multilevel Interconnection Conference, VMIC 2005
CountryUnited States
CityFremont, CA
Period10/4/0510/6/05

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

Senkevich, J. J., Carrow, B. P., Woods, B. W., Murray, R. E., & McDonald, J. F. (2005). Parylene X: A candidate cross-linkable chemical vapor depositable polymer for wafer-to-wafer bonding. 468-473. Paper presented at 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005, Fremont, CA, United States.
Senkevich, Jay J. ; Carrow, Brad P. ; Woods, Benjamin W. ; Murray, Rex E. ; McDonald, John F./ Parylene X : A candidate cross-linkable chemical vapor depositable polymer for wafer-to-wafer bonding. Paper presented at 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005, Fremont, CA, United States.6 p.
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Senkevich, JJ, Carrow, BP, Woods, BW, Murray, RE & McDonald, JF 2005, 'Parylene X: A candidate cross-linkable chemical vapor depositable polymer for wafer-to-wafer bonding' Paper presented at 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005, Fremont, CA, United States, 10/4/05 - 10/6/05, pp. 468-473.

Parylene X : A candidate cross-linkable chemical vapor depositable polymer for wafer-to-wafer bonding. / Senkevich, Jay J.; Carrow, Brad P.; Woods, Benjamin W.; Murray, Rex E.; McDonald, John F.

2005. 468-473 Paper presented at 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005, Fremont, CA, United States.

Research output: Contribution to conferencePaper

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Senkevich JJ, Carrow BP, Woods BW, Murray RE, McDonald JF. Parylene X: A candidate cross-linkable chemical vapor depositable polymer for wafer-to-wafer bonding. 2005. Paper presented at 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005, Fremont, CA, United States.