TY - GEN
T1 - Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model
AU - Jing, Jianping
AU - Gao, Feng
AU - Johnson, Janine
AU - Liang, Frank Z.
AU - Williams, Richard L.
AU - Qu, Jianmin
PY - 2009
Y1 - 2009
N2 - In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.
AB - In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.
UR - https://www.scopus.com/pages/publications/70149109145
UR - https://www.scopus.com/pages/publications/70149109145#tab=citedBy
U2 - 10.1115/IMECE2008-68891
DO - 10.1115/IMECE2008-68891
M3 - Conference contribution
SN - 9780791848678
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 171
EP - 176
BT - Electronics and Photonics
PB - American Society of Mechanical Engineers (ASME)
T2 - 2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
Y2 - 31 October 2008 through 6 November 2008
ER -