Single-step through-hole punching by hot embossing

Aaron D. Mazzeo; Matthew Dirckx; David E. Hardt

Single-step through-hole punching by hot embossing

Aaron D. Mazzeo, Matthew Dirckx, David E. Hardt

Research output: Contribution to conference › Paper › peer-review

Abstract

Hot micro-embossing is a promising manufacturing technique for replicating millimeter to nanometer scale features, including fluidic channels, in thermoplastic parts. Complex microfluidic devices will require multiple functional layers as well as interlayer vias. We demonstrate a mated aluminum tool pair with integrated punch and die features. The punched hole diameters are approximately 500 μm, 740 μm, 1.0 mm, and 2.0 mm. The embossed through-holes were punched in PMMA at 120°C with a velocity of 0.5 mm/min. The tool set also demonstrates the feasibility of forming channels on both sides of the part and producing interface ports and interlayer vias in a single step.

Original language	American English
Pages	2931-2935
Number of pages	5
State	Published - 2007
Externally published	Yes
Event	Society of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007 - Cincinnati, OH, United States Duration: May 6 2007 → May 11 2007

Other

Other	Society of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007
Country/Territory	United States
City	Cincinnati, OH
Period	5/6/07 → 5/11/07

ASJC Scopus subject areas

Chemical Engineering(all)
Polymers and Plastics

Cite this

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title = "Single-step through-hole punching by hot embossing",

abstract = "Hot micro-embossing is a promising manufacturing technique for replicating millimeter to nanometer scale features, including fluidic channels, in thermoplastic parts. Complex microfluidic devices will require multiple functional layers as well as interlayer vias. We demonstrate a mated aluminum tool pair with integrated punch and die features. The punched hole diameters are approximately 500 μm, 740 μm, 1.0 mm, and 2.0 mm. The embossed through-holes were punched in PMMA at 120°C with a velocity of 0.5 mm/min. The tool set also demonstrates the feasibility of forming channels on both sides of the part and producing interface ports and interlayer vias in a single step.",

author = "Mazzeo, {Aaron D.} and Matthew Dirckx and Hardt, {David E.}",

year = "2007",

language = "American English",

pages = "2931--2935",

note = "Society of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007 ; Conference date: 06-05-2007 Through 11-05-2007",

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T1 - Single-step through-hole punching by hot embossing

AU - Mazzeo, Aaron D.

AU - Dirckx, Matthew

AU - Hardt, David E.

PY - 2007

Y1 - 2007

N2 - Hot micro-embossing is a promising manufacturing technique for replicating millimeter to nanometer scale features, including fluidic channels, in thermoplastic parts. Complex microfluidic devices will require multiple functional layers as well as interlayer vias. We demonstrate a mated aluminum tool pair with integrated punch and die features. The punched hole diameters are approximately 500 μm, 740 μm, 1.0 mm, and 2.0 mm. The embossed through-holes were punched in PMMA at 120°C with a velocity of 0.5 mm/min. The tool set also demonstrates the feasibility of forming channels on both sides of the part and producing interface ports and interlayer vias in a single step.

AB - Hot micro-embossing is a promising manufacturing technique for replicating millimeter to nanometer scale features, including fluidic channels, in thermoplastic parts. Complex microfluidic devices will require multiple functional layers as well as interlayer vias. We demonstrate a mated aluminum tool pair with integrated punch and die features. The punched hole diameters are approximately 500 μm, 740 μm, 1.0 mm, and 2.0 mm. The embossed through-holes were punched in PMMA at 120°C with a velocity of 0.5 mm/min. The tool set also demonstrates the feasibility of forming channels on both sides of the part and producing interface ports and interlayer vias in a single step.

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M3 - Paper

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EP - 2935

T2 - Society of Plastics Engineers Annual Technical Conference: Plastics Encounter at ANTEC 2007

Y2 - 6 May 2007 through 11 May 2007

ER -

Single-step through-hole punching by hot embossing

Abstract

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ASJC Scopus subject areas

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